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Ultrasonic Soldering Equipment

Benefits and Applications

Ultrasonic energy introduced into a dip solder pot eliminates the need for flux while enhancing many soldering processes. It also provides a means to bond solder to a number of materials including aluminum and glass that are difficult or impossible to solder using conventional soldering techniques. Blackstone-NEY Ultrasonics has patented a perfected technique for introducing ultrasonic energy into dip solder pots and is the manufacturing leader of this type of equipment in the world today.

Blackstone-NEY Ultrasonics' solder pots are activated by externally mounted transducers which allow large volume multi-part dipping. The systems' controls are adaptable to automated lines.


  • High efficiency piezoelectric transducers permanently attached to solder vessel
  • Adjustable solid state thermocouple temperature control
  • Temperature read-out on all TP-3D-2 and TP-6B units
  • 300 series stainless steel solder vessel
  • Totally activated solder volume
  • Solid state "autotuned" ultrasonic system
  • Designed to withstand total power shutdown
  • Fan cooled transducer and ultrasonic system

Electronic Component Tinning and Soldering

Component lead solderability is a major consideration when devices are to be incorporated into high reliability hardware such as that used by the military, human implants including pacemakers and defibrillators, and for aerospace applications. This is especially true in cases where the device, once installed, is not accessible for service. In these critical applications it is commonplace to "tin" component leads when they arrive at the assembly house and prior to going into storage. In some cases the component leads may again be "tinned" immediately prior to use. Ultrasonic tinning offers several advantages over conventional flux methods for high reliability lead tinning.

The ultrasonic soldering process does not use flux. Ultrasonic cavitation and implosion provide the mechanism to mechanically remove surface oxides to allow solder adhesion to take place. Since there is no flux used, there is no chance of solder splatter or the inclusion of flux or flux decomposition byproducts in the solder coating. The necessity to remove flux residues after soldering is also eliminated.

Since there is no flux, there is no "wicking" of solder above the solder level. This means that solder will not wick into stranded wires or into connector contacts.

The ultrasonic soldering process excels in the removal of protective gold, silver, and other platings from lead surfaces. Military and NASA specifications recommend ultrasonic soldering for gold removal.

Ultrasonic tinning has been successful in restoring the solderability of component leads that could not be recovered using the fluxes allowed by military and other specifications. The vigorous mechanical scrubbing provided by ultrasonic energy surpasses many other mechanical recovery techniques.


DimensionsSolder Pot Internal3" Diameter x 1" Deep9"x4"x3" Deep
Pot Module Overall6 1/2" x 6 1/2" x 9 3/4" High16 1/2"x10"x14" High**
Control Module Overall9 7/8"x10 1/8"x 5 3/4" High25 1/4"x9 1/8"x14 1/2" High25 1/4"x9 1/8"x14 1/2" High
Ultrasonic Frequency21 kHz45 kHz
TransducersHigh Efficiency Composite Piezoelectric
Temperature Range0 to 800 degrees F100 to 1000 degrees F
Temperature ControlThermocouple Type Solid State
Temperature ReadoutNot AvailableStandard
Pot Heaters500 Watts3000 Watts
Ultrasonic TimerNot AvailableOptional
Foot SwitchStandardOptional
Ultrasonic Power ControlNot AvailableOptional
Power Requirements120 Volts 50/60 Hz 1 KVA240 Volts 50/60 Hz 3.5 KVA
*Longer pots avaialbe up to 54" consult factory for more information.

**Height adjustable to 16" with leveling feet.