Ultrasonic energy introduced into a dip solder pot eliminates the need for flux while enhancing many soldering processes. It also provides a means to bond solder to a number of materials including aluminum and glass that are difficult or impossible to solder using conventional soldering techniques. Blackstone-NEY Ultrasonics has patented a perfected technique for introducing ultrasonic energy into dip solder pots and is the manufacturing leader of this type of equipment in the world today.
Blackstone-NEY Ultrasonics' solder pots are activated by externally mounted transducers which allow large volume multi-part dipping. The systems' controls are adaptable to automated lines.
Component lead solderability is a major consideration when devices are to be incorporated into high reliability hardware such as that used by the military, human implants including pacemakers and defibrillators, and for aerospace applications. This is especially true in cases where the device, once installed, is not accessible for service. In these critical applications it is commonplace to "tin" component leads when they arrive at the assembly house and prior to going into storage. In some cases the component leads may again be "tinned" immediately prior to use. Ultrasonic tinning offers several advantages over conventional flux methods for high reliability lead tinning.
The ultrasonic soldering process does not use flux. Ultrasonic cavitation and implosion provide the mechanism to mechanically remove surface oxides to allow solder adhesion to take place. Since there is no flux used, there is no chance of solder splatter or the inclusion of flux or flux decomposition byproducts in the solder coating. The necessity to remove flux residues after soldering is also eliminated.
Since there is no flux, there is no "wicking" of solder above the solder level. This means that solder will not wick into stranded wires or into connector contacts.
The ultrasonic soldering process excels in the removal of protective gold, silver, and other platings from lead surfaces. Military and NASA specifications recommend ultrasonic soldering for gold removal.
Ultrasonic tinning has been successful in restoring the solderability of component leads that could not be recovered using the fluxes allowed by military and other specifications. The vigorous mechanical scrubbing provided by ultrasonic energy surpasses many other mechanical recovery techniques.
|Dimensions||Solder Pot Internal||3" Diameter x 1" Deep||9"x4"x3" Deep|
|Pot Module Overall||6 1/2" x 6 1/2" x 9 3/4" High||16 1/2"x10"x14" High**|
|Control Module Overall||9 7/8"x10 1/8"x 5 3/4" High||25 1/4"x9 1/8"x14 1/2" High||25 1/4"x9 1/8"x14 1/2" High|
|Ultrasonic Frequency||21 kHz||45 kHz|
|Transducers||High Efficiency Composite Piezoelectric|
|Temperature Range||0 to 800 degrees F||100 to 1000 degrees F|
|Temperature Control||Thermocouple Type Solid State|
|Temperature Readout||Not Available||Standard|
|Pot Heaters||500 Watts||3000 Watts|
|Ultrasonic Timer||Not Available||Optional|
|Ultrasonic Power Control||Not Available||Optional|
|Power Requirements||120 Volts 50/60 Hz 1 KVA||240 Volts 50/60 Hz 3.5 KVA|