Benefits and Applications
Ultrasonic energy introduced into a dip solder pot eliminates the need for flux while enhancing many soldering processes. It also provides a means to bond solder to a number of materials including aluminum and glass that are difficult or impossible to solder using conventional soldering techniques. Blackstone-NEY Ultrasonics has perfected a technique for introducing ultrasonic energy into dip solder pots and is the exclusive manufacturer of this type of equipment in the world today.
Blackstone-NEY Ultrasonics' solder pots are activated by externally mounted transducers which allow large volume multi-part dipping. The systems' controls are adaptable to automated lines.
Electronic Component Tinning and Soldering
Component lead solderability is a major consideration when devices are to be incorporated into high reliability hardware such as that used by the military, human implants including pacemakers and defibrillators, and for aerospace applications. This is especially true in cases where the device, once installed, is not accessible for service. In these critical applications it is commonplace to "tin" component leads when they arrive at the assembly house and prior to going into storage. In some cases the component leads may again be "tinned" immediately prior to use. Ultrasonic tinning offers several advantages over conventional flux methods for high reliability lead tinning.
The ultrasonic soldering process does not use flux. Ultrasonic cavitation and implosion provide the mechanism to mechanically remove surface oxides to allow solder adhesion to take place. Since there is no flux used, there is no chance of solder splatter or the inclusion of flux or flux decomposition byproducts in the solder coating. The necessity to remove flux residues after soldering is also eliminated.
Since there is no flux, there is no "wicking" of solder above the solder level. This means that solder will not wick into stranded wires or into connector contacts.
The ultrasonic soldering process excels in the removal of protective gold, silver, and other platings from lead surfaces. Military and NASA specifications recommend ultrasonic soldering for gold removal.
Ultrasonic tinning has been successful in restoring the solderability of component leads that could not be recovered using the fluxes allowed by military and other specifications. The vigorous mechanical scrubbing provided by ultrasonic energy surpasses many other mechanical recovery techniques.
- Patented high efficiency piezoelectric transducers permanently attached to solder vessel
- Adjustable solid state thermocouple temperature control
- Temperature read-out on all TP-3D-2 and TP-6B units
- 300 series stainless steel solder vessel
- Stainless steel exterior surfaces
- Totally activated solder volume
- Solid state "autotuned" ultrasonic system
- Designed to withstand total power shutdown
- Fan cooled transducer and ultrasonic system
- Electrically grounded solder pot
Solder Pot Internal
3" Diameter x 1" Deep
Pot Module Overall
6 1/2" x 6 1/2" x 9 3/4" High
16 1/2"x10"x14" High**
Control Module Overall
9 7/8"x10 1/8"x 5 3/4" High
25 1/4"x9 1/8"x14 1/2" High
25 1/4"x9 1/8"x14 1/2" High
High Efficiency Composite Piezoelectric
0 to 800 degrees F
100 to 1000 degrees F
Thermocouple Type Solid State
Ultrasonic Power Control
120 Volts 50/60 Hz 1 KVA
240 Volts 50/60 Hz 3.5 KVA